Sip Double-sided Tape Process Line Equipment Introduction

Application: chip, semiconductor

Main functions: automatic loading and unloading, pressing of adhesive parts, sputtering process into Tray

Product features: Sputtering equipment, is a process technology for thin film deposition

Device compatibility is strong, can be quickly changed.

The film thickness is controllable and repeatable, suitable for the deposition of metals, semiconductors, compounds or mixtures.

The combination of film and substrate is strong, which is suitable for large-scale automatic production.

Data acquisition, backup, code scanning and connection to the plant management system (MES) are implemented with the Sputter double-sided tape process

Sip Single Side Tape Process Line Equipment Introduction

The main equipment are: adhesive equipment, patch equipment, scanning code pressing equipment, automatic loading and unloading equipment, top pin equipment, cleaning equipment, receiving equipment.

Application: chip, semiconductor

Main functions: automatic loading and unloading of vehicle, pressing of adhesive parts, sputtering process into Tray

Product features: Sputtering equipment, is a process technology for thin film deposition

Device compatibility is strong, can be quickly changed.

The film thickness is controllable and repeatable, suitable for the deposition of metals, semiconductors, compounds or mixtures.

The combination of film and substrate is strong, which is suitable for large-scale automatic production.

Data acquisition, backup, code scanning and connection to the plant management system (MES) for the Sputter single-sided tape process